India’s Tectronics Engineers Sees Success at TES Dubai

Scenes from TES Dubai; images courtesy of Tectronics Engineers

Tectronics Engineers, one of India’s fastest-growing companies, reports it saw success at The Elevator Show (TES) Dubai on September 16-18, receiving outstanding feedback from elevator industry professionals. Tectronics showcased its innovative gearless elevator machine technology at TES Dubai, engaging with attendees from countries including India, the U.A.E., Saudi Arabia and Egypt, as well as Europe and Africa. Visitors to the Tectronics Engineers booth provided “valuable insights that will guide the company’s future developments” as it seeks to actively expand to other markets. During both TES Dubai and Interlift 2023 in Germany, Tectronics said it “impressed visitors with its commitment to advancing vertical transportation.”

Get more of Elevator World. Sign up for our free e-newsletter.

Please enter a valid email address.
Something went wrong. Please check your entries and try again.

WURTEC LEADS CREATION OF NATIONAL ELEVATOR MECHANICS DAY

Wurtec Leads Creation of National Elevator Mechanics Day

NEW YORK BUILD 2025 SHOW GUIDE GOES LIVE AS EVENT APPROACHES

New York Build 2025 Show Guide Goes Live as Event Approaches

The Kashkadarya region of Uzbekistan; image courtesy of Euroasia Travels

Tatlift Plans for Elevator Production in Kashkadarya

The West Suburban Medical Center campus in River Forest, Illinois; image courtesy of West Suburban Medical Center

Illinois Medical Center’s Elevators Pass Inspection After a Year of Failure

EARLY BIRD REGISTRATION AND SPEAKER ABSTRACTS FOR ELEVCON IN LISBON

Early Bird Registration and Speaker Abstracts for Elevcon in Lisbon

MOSELEY ELEVATOR SERVICE OPENS NEW OFFICE, HIRES VP

Moseley Elevator Service Opens New Office, Hires VP

image courtesy of the North Carolina Department of Labor via The Carolina Journal

New Elevator Inspection Certificate Revealed for North Carolina

CTBUH CALLS FOR SUBMISSIONS FOR THE 2025 INTERNATIONAL CONFERENCE

CTBUH Calls for Submissions for the 2025 International Conference